Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus, a chipmaker focusing on front-end semiconductor production and back-end packaging, is set to discuss its advancements in panel-level packaging (PLP) on glass substrates at the SEMICON Japan event. The company's development centers around 600mm x 600mm glass panels for high-end multi-chiplet processors, aiming to surpass competitors by utilizing cutting-edge technologies. While traditional packaging relies on silicon interposers, Rapidus is exploring the use of glass substrates for improved performance in AI and HPC applications. The integration of PLP and glass substrates could potentially revolutionize chip packaging in the late 2020s, positioning Rapidus as a frontrunner in the industry.