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Next-generation 3D DRAM approaches reality as scientists achieve 120-layer stack using advanced deposition techniques
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Tom's Hardware
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Alibaba’s AI chip goes head-to-head with Nvidia H20 in state-backed benchmark demo
Alibaba's semiconductor unit, T-Head, has developed an AI processor, the PPU, that reportedly matches Nvidia's H20 GPU in performance. The comparison was showcased on China Central Television during a broadcast about Premier Li Qiang's visit to a computing center. The PPU features 96 GB of HBM2e, 700 GB/s chip-to-chip interconnect, PCIe support, and 400 W board power. China Unicom has already deployed 16,384 PPU cards, delivering 3,579 petaflops of compute power. The geopolitical context involves Nvidia's H20 being tailored to comply with U.S. export controls, while Alibaba's software compatibility and real-world performance remain to be seen.
Tom's Hardware•
China's largest chipmaker testing first homegrown immersion DUV litho tool — SMIC takes significant step on road to wafer fab equipment self-sufficiency
China's largest chipmaker, SMIC, is testing one of China's first domestic immersion DUV lithography tools, a significant step towards self-sufficiency in wafer fab equipment. The system, developed by Shanghai Yuliangsheng Technology Co., could potentially be used for 7nm or 5nm production nodes. SMIC aims to localize its entire supply chain to reduce reliance on U.S. or European export policies. The tool, codenamed 'Mount Everest,' is part of China's efforts to advance its chip production capabilities. However, it may take until 2030 for SMIC to achieve sub-10nm fabrication processes on domestic lithography systems.
Tom's Hardware•
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.
SemiWiki•
MindsEye's sabotage mission is being slammed as dull and pointless
Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.
TweakTown•