Next-Gen AI Needs Liquid Cooling

The article discusses the increasing need for liquid cooling in next-gen AI data centers due to the rising power density of advanced computer chips, particularly driven by AI applications. Liquid cooling is becoming essential to manage the excessive heat generated by high-power chips. Various methods of liquid cooling are explored, such as single-phase direct-to-chip cooling, two-phase direct-to-chip cooling, single-phase immersion cooling, and two-phase immersion cooling. Each method offers unique advantages in cooling efficiency and energy savings, with the industry leaning towards liquid cooling as the future solution for cooling high-power AI-focused data centers.