Multiphase Power Module Supplies AI from Beneath the Board

Infineon has introduced a new generation of multiphase power modules designed to supply AI chips by implementing vertical power delivery beneath server boards and AI accelerator cards. This innovative approach reduces resistive losses and improves power integrity by relocating power electronics under the PCB, shortening the distance power needs to travel. The new TDM2454xx module features four synchronous buck converters with integrated decoupling capacitors and can deliver up to 280 A of peak current. By stacking inductors and capacitors directly on top of the module, Infineon aims to enhance current redistribution, reduce impedance, and improve transient response time. Additionally, the module includes on-chip current and temperature sensing for monitoring and protection, helping balance current between phases and ensuring system efficiency.