Technology

Multi-Die Assemblies Require More Detailed Test Plan Earlier

Source

SemiEngineering

Published

Jan 29, 2026

TL;DR

AI Generated

Engineering teams working on complex multi-die assemblies are facing challenges in mapping out component interactions and developing detailed test plans earlier in the design process to ensure proper functionality and reliability. Design for test (DFT) strategies need to be more detailed due to increased connections and inaccessible components. The shift left methodology is crucial for catching issues upfront at the RTL stage, especially with the growing complexity of designs involving chiplets, memories, and advanced packaging. Ensuring proper connectivity and controllability at the RTL stage is key to avoiding downstream errors and costly iterations.

Read Full Article

Turtle Beach's new mouse has a 2.25-inch touchscreen and hotswap batteries that last 15 hours apiece — 'MC7' costs $160, part of company's new Command Series peripheral lineup

Turtle Beach has unveiled its new Command Series peripherals, including the flagship MC7 mouse with a 2.25-inch touchscreen, hotswap batteries lasting 15 hours each, and a $160 price tag. The mouse features a 30,000 DPI sensor, optical switches, and customizable buttons, along with OBS and Streamlabs compatibility. Additionally, there are more affordable options like the MC5 and MC3 with varying features. The company also introduced new keyboards, such as the KB7 with a 4.3-inch touchscreen, hall-effect switches, and a $200 price tag. The peripherals are available for pre-order on Turtle Beach's website.

Tom's Hardware•

5 days ago

SemiEngineering

Chiplet Standards Aim For Plug-n-Play

Chiplet standards are crucial for creating a marketplace where chiplets can be easily interchanged like LEGOs. Various standards are being developed to ensure interoperability and physical composability of chiplets, including die-to-die interconnect standards like Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe). These standards cover system architecture, security, power delivery, data semantics, physical placement, testing, and more. Organizations like the Open Compute Project (OCP) are leading efforts to standardize chiplet-related aspects, such as packaging descriptions and system architectures. The goal is to pave the way for a plug-and-play chiplet marketplace, although challenges related to practical and economic factors still exist.

SemiEngineering•

2 weeks ago

WEBINAR: Outrunning the Data Wave – Why we need to keep pace with the coming 400% data surge

The semiconductor manufacturing industry is facing a significant surge in data volume, with data growth projected to reach 400% or more by 2030. To keep pace with this data wave, the industry is adopting advanced semiconductor design strategies, chiplets, and optical I/O integration to enhance performance and modularity. The increasing data complexity requires precise data tracking, cross-domain correlation, and insightful analytics to optimize yield, reliability, and throughput. Engineers are advised to implement unified data infrastructure, commonality correlation, scalable analytics workflows, and data genealogy management to effectively manage the data surge. Manufacturers need to build resilient data infrastructure and analytics workflows to leverage the benefits of chiplets and photonics without being overwhelmed by the data generated.

SemiWiki•

2 months ago

Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit

Qnity and Silicon Catalyst were highlighted at the Chiplet Summit, focusing on chiplet design and integration. Silicon Catalyst, an accelerator for semiconductor startups, showcased promising companies. Qnity, a strategic partner, is a major player in advanced electronics materials and solutions, impacting the semiconductor supply chain. With a vast technology base, Qnity aims to advance chiplet designs by addressing the complexities of the new chiplet supply chain dynamics. The company's interdisciplinary approach and collaboration across the supply chain position it uniquely in the chiplet market. Silicon Catalyst also featured other portfolio companies like Athos Silicon, CrossFire Technologies, HEPT Lab, and Quadric at the summit.