Multi-Die Assemblies Require More Detailed Test Plan Earlier

Engineering teams working on complex multi-die assemblies are facing challenges in mapping out component interactions and developing detailed test plans earlier in the design process to ensure proper functionality and reliability. Design for test (DFT) strategies need to be more detailed due to increased connections and inaccessible components. The shift left methodology is crucial for catching issues upfront at the RTL stage, especially with the growing complexity of designs involving chiplets, memories, and advanced packaging. Ensuring proper connectivity and controllability at the RTL stage is key to avoiding downstream errors and costly iterations.