Technology

Monstrous SSD cooling solution strapped to iPhone 17 Pro Max delivers unparalleled performance — clocks 90% stability in 3D Mark Stress Test, jury still out on hideous aesthetics

Source

Tom's Hardware

Published

Oct 2, 2025

TL;DR

AI Generated

A tech enthusiast has enhanced the iPhone 17 Pro Max with a complex SSD cooling setup, achieving over 90% stability in a 3D Mark Stress Test. The modification aims to improve performance stability for demanding tasks like Apple ProRes video recording. While the aesthetics of the cooling solution are questionable, the improved stability could benefit users engaging in sustained high-resolution recording sessions. Apple's shift to a vapor chamber cooling system in the iPhone 17 Pro models signifies a focus on sustained performance, with claims of significant cooling improvements over previous models.

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Every iPhone 17 Pro user will be haunted by Apple's egregious design flaw

The article discusses a design flaw in the iPhone 17 Pro that will reportedly haunt users. However, the content provided seems to be a script related to enabling JavaScript and cookies to continue viewing the article, making it difficult to ascertain the specific details of the flaw.

TweakTown•

8 months ago

Apple's A19 Pro beats Ryzen 9 9950X in single-thread Geekbench tests — iPhone 17 Pro chip packs 11-12% CPU performance bump, GPU performance up 37% over predecessor

Apple's new A19 Pro chip for the iPhone 17 Pro outperforms its predecessor and rivals like the Snapdragon 8 Elite, even surpassing desktop CPUs in single-thread Geekbench tests. The CPU offers an 11-12% performance boost and the GPU shows a 37% improvement over the previous model. The A19 Pro features two high-performance cores and four energy-efficient cores, with enhancements like improved branch prediction and increased cache size. The processor, manufactured by TSMC on the N3P process, demonstrates solid clock speed gains and microarchitectural improvements. Despite not significantly increasing CPU clocks, the A19 Pro excels in single-thread workloads and GPU performance.

Tom's Hardware•

8 months ago

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki•

9 hours ago

MindsEye's sabotage mission is being slammed as dull and pointless

Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.