Microelectronics and Advanced Packaging Technologies Roadmap 2.0 (SRC)

The Semiconductor Research Corporation has released the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, an update to the industry's first 3D semiconductor roadmap. The roadmap, developed by over 370 experts from 132 organizations, includes new content and a chapter on digital twins and their applications. Funded by the U.S. Department of Commerce's NIST, the roadmap supports the CHIPS Act by providing a strategic framework for the semiconductor supply chain. You can access the MAPT roadmap for more information.