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Membrane evaporative cooling tech achieves record-breaking results, could be solution for next-generation AI server cooling — clocks 800 watts of heat flux per square centimeter

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Tom's Hardware

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Engineers at the University of California, San Diego, have developed a new cooling technology using a fiber membrane that leverages evaporative cooling to efficiently cool AI server components. The membrane features interconnected microscopic pores that facilitate the absorption and vaporization of coolant to dissipate heat. This innovative design achieved a record-breaking 800 watts of heat flux per square centimeter, making it a promising solution for power-hungry data center applications. The system addresses previous issues with evaporative cooling designs by utilizing fiber membranes with optimal pore sizes to prevent clogging and boiling, ensuring stable and effective cooling performance.

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