Back to home
Technology

Listen to Earth’s rumbling, secret soundtrack

Source

MIT Technology Review

Published

TL;DR

AI Generated

Artist Brian House has created an album called "Everyday Infrasound in an Uncertain World" that captures the imperceptible noises of nature, like the rumble of a wildfire or the roar of a storm, at frequencies below the threshold of human hearing. House uses specialized tools to pick up these infrasounds and translate them into pulsing music, offering a unique perspective on ambient music. Scientists have helped House in setting up his music-gathering array, highlighting the intriguing phenomena of these distant, low-frequency sounds. The resulting music is a 24-minute otherworldly chorus that alternates between grumbling vibrations and ghostlike whispers, connecting listeners to a wider and deeper world.

Read Full Article

Similar Articles

In a blind test, audiophiles couldn't tell the difference between audio signals sent through copper wire, a banana, or wet mud — 'The mud should sound perfectly awful, but it doesn't,' notes the experiment creator

In a blind test, audiophiles couldn't tell the difference between audio signals sent through copper wire, a banana, or wet mud — 'The mud should sound perfectly awful, but it doesn't,' notes the experiment creator

A blind test conducted by a moderator on diyAudio revealed that listeners struggled to differentiate between audio signals transmitted through copper wire, a banana, or wet mud. Results showed that participants could not reliably identify which wiring setup was used for the audio tracks. The experiment aimed to test whether materials like bananas and mud, despite being poor conductors, could introduce noticeable changes to the audio signal. The findings suggested that listeners could not detect any significant alterations introduced by different materials, highlighting the surprising similarity in sound quality across various unconventional conductors.

Tom's Hardware
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki
MindsEye's sabotage mission is being slammed as dull and pointless

MindsEye's sabotage mission is being slammed as dull and pointless

Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.

TweakTown
3DPrint.com

The Additive Chicken Coop, Part II: Rescoping

The article discusses the second part of the Additive Chicken Coop project, focusing on rescaling the project. It highlights the challenges faced in enabling JavaScript and cookies to continue reading the content. The article provides insights into the technical aspects of the project and the strategies employed to address the issues encountered during the rescaling process.

3DPrint.com

We use cookies

We use cookies to ensure you get the best experience on our website. For more information on how we use cookies, please see our cookie policy.