Keynote: On-Package Chiplet Innovations with UCIe

The Universal Chiplet Interconnect Express (UCIe) standard, presented at the Chiplet Summit 2026, aims to revolutionize on-package chiplet integrations by enabling modular, high-performance chiplet architectures. UCIe addresses limitations of traditional SoC designs, offering benefits like overcoming reticle size constraints, reducing development time, and optimizing yields. With over 140 members, including industry giants like AMD, Intel, and NVIDIA, the UCIe Consortium promotes openness, backward compatibility, and continuous innovation. UCIe's evolution spans three generations, with UCIe 2.0 introducing vertical stacking for increased bandwidth density and low power consumption. Demonstrations have shown successful interoperability tests and high-speed data traffic, indicating a growing adoption of chiplet technology in various segments.