Intel shows off leading-edge tech with massive AI processor test vehicle — huge chip features four logic tiles, 12 HBM4 stacks, and 8X reticle size

Intel showcased a massive 'AI chip test vehicle' demonstrating its packaging capabilities for AI and HPC applications. The system-in-package features four logic tiles, 12 HBM4 stacks, and 8X reticle size, showcasing Intel's construction method for future processors. The platform includes Intel's 18A process technology, PowerVia backside power delivery, and EMIB-T 2.5D bridges for interconnection density and power delivery. Intel's roadmap includes vertical integration with Foveros packaging technologies for multi-chiplet designs, emphasizing power delivery innovations for AI workloads. While the 'AI chip test vehicle' serves as a customer attraction, its use in Intel's upcoming Jaguar Shores AI accelerator in 2027 remains uncertain.