Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM

Intel Foundry is showcasing a groundbreaking multi-chiplet package design that surpasses current AI processors in size, featuring 16 compute elements, 24 HBM5 memory stacks, and 18A SRAM. The package is 12 times larger than the largest AI chips on the market, outperforming TSMC's offerings. The design incorporates innovative technologies like Foveros Direct 3D for connectivity and EMIB-T for interconnections, aiming to power next-generation multichip platforms. Intel's ambitious plans include integrating PCIe 7.0, optical engines, and proprietary accelerators, with potential challenges in power consumption and cooling for such advanced processors.