How AI Is Reshaping Memory in the Data Center

AI is reshaping memory in data centers, with memory becoming a major bottleneck due to AI and data center growth. Brian Watson from Winbond discusses the shift from DDR4 to DDR5, challenges with HBM, and the importance of legacy memory technologies. Winbond helps bridge supply gaps and offers solutions like CUBE architecture for high-bandwidth applications. This conversation sheds light on the memory pressures impacting AI, data centers, and engineering.