Technology

HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027

Source

Tom's Hardware

Published

Dec 2, 2025

TL;DR

AI Generated

High-bandwidth memory (HBM) is undergoing significant changes with the introduction of HBM4, HBM4E, and C-HBM4E, set to hit the market by 2026 and 2027. These new iterations will feature a 2,048-bit interface and advanced logic technologies, promising a 2.5x performance boost with speeds of up to 12.8 GT/s. HBM4 will double concurrency to 32 independent channels per stack, supporting configurations for up to 64 GB capacities. Additionally, HBM4E will offer 2.5x higher bandwidth than HBM3E, with improved power efficiency and area efficiency. C-HBM4E introduces customizable base dies, allowing for the integration of custom logic directly into memory devices, potentially revolutionizing memory subsystems.

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HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027

TL;DR

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Lexar regional manager says that RAM prices are expected to double by the end of the year — 'discounts' and stabilized prices result from distributors getting rid of old stock or sourcing products from other regions

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HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027

TL;DR

Similar Articles

Lexar regional manager says that RAM prices are expected to double by the end of the year — 'discounts' and stabilized prices result from distributors getting rid of old stock or sourcing products from other regions

Taiwanese startup FormulaV Line wants to break into US market with two new unique cases — company expects products to become available on Newegg later this year

G.Skill explains how AMD EXPO ULL unlocks additional performance — expanded profiles allow memory makers to include subtiming tweaks for the first time

Huawei-led team claims it post-trained DeepSeek's 1.6-trillion-parameter model — 1,000 Ascend 910C chips used in training