Gallium-Based SMP for High-Performance Cu-to-Cu Bonding (National Cheng Kung Univ.)

Researchers at National Cheng Kung University published a technical paper on "Sonochemical Synthesis of Submicrometer Ga-Based Particles for Cu-to-Cu Interconnection." The paper discusses the use of gallium-based submicrometer particles (SMPs) for high-strength, thermally stable, and low-resistance Cu-to-Cu bonding in electronic devices. This bonding method offers advantages for advanced electronic interconnection, such as 3D IC and high-power devices, operating in extreme conditions. The research demonstrates the potential and feasibility of using Ga-based SMP for high-performance Cu-to-Cu bonding, offering thermal stability and reliability without the formation of intermetallic compounds.