Technology

Framework 13 Pro targets MacBook Pro with CNC aluminum build, Panther Lake, and modular design, starting at $1,199

Source

TweakTown

Published

Apr 22, 2026

TL;DR

AI Generated

The Framework 13 Pro, unveiled at Framework's Next Gen event, is a modular laptop targeting the MacBook Pro with a CNC-milled aluminum body, Panther Lake processor, and a starting price of $1,199. It features a custom 120Hz VRR touchscreen, haptic trackpad, and a 74 Wh battery. The laptop offers a unibody-like feel, a new Graphite finish, and a 13.5-inch 2.8K display with 30-120Hz VRR. Customers can choose between AMD Ryzen AI 300 series and Intel's Core Ultra Series 3 processors, with pricing for various configurations. The laptop is Ubuntu Certified and available for pre-order, with shipments starting in June 2026.

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Thunderobot's new ZERO Air gaming laptop with Intel Panther Lake CPU to be unveiled at CES 2026

Thunderobot is set to reveal its new ZERO Air gaming laptop featuring an Intel Panther Lake CPU at CES 2026. The laptop is anticipated to offer high performance for gaming enthusiasts. This unveiling is expected to showcase cutting-edge technology and innovation in the gaming laptop industry. Thunderobot's new release aims to cater to the demands of gamers seeking powerful and efficient devices. The Intel Panther Lake CPU is likely to enhance the laptop's processing capabilities, providing a seamless gaming experience.

TweakTown•

5 months ago

Intel Panther Lake SKUs spotted in HWMonitor update — release notes specify Core Ultra X, H, and U variants

Intel's Panther Lake series of mobile processors, based on the 18A process node, has been revealed in HWMonitor's update notes, including Core Ultra X, H, and U variants. The lineup combines elements from Lunar Lake and Arrow Lake, offering improved efficiency and performance with Cougar Cove performance cores, Darkmont efficiency cores, and Xe3 integrated graphics with up to 12 Xe cores. The processors are designed for different performance levels and price segments, with SKUs like Core Ultra X9 388H expected to be Intel's flagship chip. The Panther Lake SoCs will feature different core configurations and memory support, with the top-tier Core Ultra X models likely reserved for high-performance chips. Intel is set to confirm final SKUs later this year, with products expected to launch by the end of 2025.

Tom's Hardware•

7 months ago

Intel takes the wraps off Panther Lake — first 18A client processor brings the best of Lunar Lake and Arrow Lake together in one package

Intel unveiled details about its upcoming Panther Lake processors, manufactured on an 18A node, promising 50% more performance or 30% less power consumption compared to previous chips. The Panther Lake lineup combines power efficiency from Lunar Lake and performance scalability from Arrow Lake. These improvements are crucial as Intel faces competition from AMD, Qualcomm, and Apple in the laptop processor market. Panther Lake SoCs offer more flexibility in memory configurations and feature advanced technologies like RibbonFET transistors and PowerVia backside power delivery. The chips are expected to be available in January 2026, with more details likely to be revealed at CES 2026.

Tom's Hardware•

7 months ago

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki•

9 hours ago