Technology

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

Source

SemiEngineering

Published

Jul 24, 2025

TL;DR

AI Generated

The article discusses the challenges faced by high-performance computing devices in heat dissipation and the importance of effective thermal management to maintain optimal performance and reliability. It explores the use of indium metal thermal interface materials (TIMs) with high thermal conductivity to improve thermal properties. The study focuses on analyzing the impact of indium alloys with different melting points on package reliability and thermal performance. Various tests, including reliability tests, scanning acoustic tomography, shadow moiré analysis, finite element analysis, and SEM inspection, were conducted to evaluate TIM coverage, package warpage, and material delamination. The results suggest that reducing the silver content in indium alloys can lead to greater TIM coverage degradation and increased package warpage at high temperatures, emphasizing the need for careful material selection in package design.

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