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This Mexican Student Is Engineering a Healthier Future

Ximena Montserrat Ramirez Aguilar, a student at the Universidad Autónoma de Nuevo León in Mexico, is focused on using AI to prevent Type 2 diabetes and other diseases. She founded the IEEE EMBS student branch in 2023 and is dedicated to engineering a healthier future through her work in biomedical engineering and health education. Aguilar's efforts align with the IEEE Engineering in Medicine and Biology Society's mission.

Handheld 3D Printer Repairs Bone Like a Glue Gun — Tested in Rabbits, Planned for OR Use

A team of researchers from Korea and the U.S. has developed a handheld 3D printing device that functions like a glue gun, printing bone-like material directly onto fractures. Tested successfully in rabbits, the device aims to enable faster and more personalized bone procedures in humans. The device, made of biodegradable materials like polycaprolactone and hydroxyapatite, can be used to print bone grafts on demand during surgery, avoiding the need for pre-made implants. The technology, still in the experimental phase, has the potential to revolutionize bone defect treatment by allowing surgeons to create customized, biodegradable, and antibacterial implants directly in the operating room. Future steps include larger animal testing and preparation for human clinical trials after meeting regulatory requirements.

Multiphysics Simulation of Electromagnetic Heating for Post-Surgical Infection Treatment in Knee Replacements

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.