DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

DARPA is investing $1.4 billion to transform a former chip plant in Austin, Texas, into a cutting-edge research foundry focused on 3D heterogeneous integration (3DHI) for next-gen chips. The facility aims to bridge the gap between lab innovation and production, supporting both national security and commercial customers. By emphasizing high-mix, low-volume production, the plant will enable experimentation with unconventional chip architectures and materials. The project, a collaboration between DARPA, the state of Texas, and the University of Texas at Austin, is part of a broader effort to bolster domestic chip manufacturing and innovation. The initiative represents a shift towards advanced packaging and heterogeneous integration in the semiconductor industry, with potential implications for high-performance computing, AI, and defense applications.