Chip Industry Technical Paper Roundup: Dec 22

The article highlights recent technical papers in the chip industry, including topics like dataflow execution on GPUs, templatized chip design, scanning acoustic microscopy for packaging, data-centric ML compiler for PIM, QPUs with slow interconnects, smartphone EM side channel attacks, memristors for ReRAMs and neuromorphic computing, and thermo-mechanical analysis of IC packaging. Papers were contributed by research organizations like NVIDIA, USC, Arizona State University, Fraunhofer, Univ. of Toronto, IonQ Inc., and others. These papers cover a range of cutting-edge developments in the semiconductor industry.