Chip Industry Technical Paper Roundup: August 26

New technical papers added to Semiconductor Engineering's library cover topics like Ultra Ethernet design principles, wire-friendly processors, thermal-aware scheduling for AI workloads, chip-to-chip photonic fabrics, photolithography for 2D materials, LLM acceleration architecture, and carbon nanotube transistors. These papers involve collaborations between various research organizations and universities like ETH Zurich, Intel, University of Wisconsin–Madison, Cornell University, and more. The papers aim to explore innovative solutions for improving performance and efficiency in semiconductor technologies. You can find more semiconductor research papers on Semiconductor Engineering's website.