Chip Industry Technical Paper Roundup: Apr. 21
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Published
TL;DR
AI GeneratedNew technical papers in the semiconductor industry cover topics such as neural computers, AFM on EUV nanostructures, photonic chip packaging for extreme environments, SSD emulation for GPU-centric storage, ruthenium interconnects, DRAM power delivery, silent data corruption, LLM training reliability, GPU Rowhammer, and privilege escalation. Researchers from various organizations like Meta AI, KAUST, Purdue University, Intel, NIST, Johns Hopkins, and UT Austin have contributed to these papers.