Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 — CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly

ChangXin Memory Technologies (CXMT) in China is set to produce third-gen high bandwidth memory (HBM3) by the end of 2026, with Naura, Maxwell, and U-Preseason developing tools for HBM assembly. CXMT has already started mass production of DDR5 and LPDDR5 memory and plans to begin HBM3 production this year. Other Chinese companies like Wuhan Xinxin Semiconductor Manufacturing (XMC) are also working on HBM projects using hybrid bonding and other technologies. The Chinese semiconductor industry faces challenges in developing competitive tools for HBM assembly due to export limitations on advanced manufacturing tools, with companies like Naura Technology expanding their tool portfolio for HBM manufacturing. Despite progress, it may take several years for China to fully localize HBM production due to the complexity of the technology.