Chinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines — secondary channels and independent engineers used to soup up Twinscan NXT series

Chinese fabs are upgrading older ASML DUV lithography machines to sustain chip output amid export controls. These upgrades aim to improve overlay accuracy and throughput on older machines, providing a capacity boost for Chinese manufacturers. With restrictions on new tool exports, Chinese firms are turning to reverse engineering and grey-market components to enhance performance. While these upgrades won't match newer EUV machines, they can help recover capacity at advanced DUV-based nodes. The actions highlight a shift in enforcement pressure to constrain output by targeting parts, expertise, and process knowledge that keep existing tools competitive.