China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028

A secret lab in China has reportedly developed a prototype extreme ultraviolet (EUV) lithography system through reverse engineering existing scanners from ASML, aiming to create prototype chips by 2028. The system uses a laser-produced plasma method similar to ASML's technology but is larger and currently unable to produce usable chips due to challenges with precision optical systems. The Chinese team includes former ASML engineers and recent graduates, with efforts to reverse engineer components monitored closely. While China aims for chip prototypes by 2028, realistic expectations suggest a timeline closer to 2030, highlighting the complexity and challenges of replicating advanced lithography technology.