Challenges In Testing Photonics In Chips

The semiconductor industry faces new challenges in testing photonics integrated into chips alongside traditional electrical components. Aftkhar Aslam, CEO of yieldWerx, highlights the lack of standards for measuring photonics, dealing with multi-modal signatures, and the impact on test time in fabrication facilities. The combination of electrical and optical tests in a single device requires new approaches to collecting and analyzing data. Standard practices for testing silicon photonics are still evolving, posing unique hurdles for ensuring reliability and consistency in chip manufacturing.