Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems

The article discusses the importance of bump and TSV planning in multi-die systems to establish high-performance interconnect structures. It highlights the critical role bumps and TSVs play in enabling communication between chiplets and package substrates for high bandwidth and low latency. Manual planning methods are no longer sufficient for modern multi-die systems due to their complexity and scale, necessitating automated bump planning methodologies. These automated workflows support efficient bump placement, signal assignment, hierarchical integration, and engineering change management to optimize multi-die floorplans and ensure design consistency. The article also mentions the Synopsys 3DIC Compiler Platform as a solution for tackling the challenges of bump and TSV planning in multi-die designs.