Back to home
Technology

Automate And Speed Up TCAD Calibration With Expert Modules And ML Calibration Accelerator

Source

SemiEngineering

Published

TL;DR

AI Generated

The article discusses the importance of automating and speeding up TCAD calibration in semiconductor manufacturing using expert modules and machine learning (ML) calibration accelerators. It highlights the challenges in semiconductor development due to increased complexity and the need for efficiency. TCAD calibration involves tuning physical model parameters to match simulated results with real device data. Synopsys offers solutions like Sentaurus Calibration Workbench (SCW) with expert calibration modules and the Sentaurus ML Calibration Accelerator to accelerate the calibration workflow by over 5X. ML enhancements in SCW allow users to create their own modules and workflows, improving TCAD accuracy and reducing calibration time.

Read Full Article

Similar Articles

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki
ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond

ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond

ASML's roadmap for chipmaking lithography tools covers four generations of technology: DUV immersion, low-NA EUV, High-NA EUV, and a Hyper-NA concept for the 2030s. Each generation offers finer resolution at higher costs and complexity, impacting the pace of transistor scaling. TSMC opts for low-NA EUV for its upcoming nodes, while ASML's High-NA tools are being adopted by Intel, Samsung, and SK hynix. The company's roadmap includes advancements in resolution and throughput, with a focus on High-NA and future Hyper-NA systems. Challenges like pellicle development and export controls shape the landscape of lithography technology adoption.

Tom's Hardware
Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%

Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%

Intel is progressing with its 18A-P process node technology, boasting higher performance, lower power consumption, and improved thermals compared to its baseline 18A technology. The 18A-P process introduces new transistors, tighter process variability control, and enhanced thermals, potentially attracting interest from companies like Apple. This enhanced technology offers a 9% performance boost or an 18% power reduction compared to the base 18A process. Additionally, improvements in skew corner tightening, threshold voltage options, and metal stack resistance and capacitance contribute to better performance efficiency and yield. The 18A-P process also focuses on enhancing thermals, reliability, and voltage behavior critical for both client and data center applications.

Tom's Hardware
Chinese GPU maker Cambricon's Q1 revenue hits $423 million as country's homegrown AI chip market accelerates — Chinese chipmakers continue to leech market share from Nvidia

Chinese GPU maker Cambricon's Q1 revenue hits $423 million as country's homegrown AI chip market accelerates — Chinese chipmakers continue to leech market share from Nvidia

Chinese GPU maker Cambricon Technologies reported a Q1 revenue of $423 million, marking a significant increase over the previous year. The company's net profit also rose by 185%, reflecting its growth in the AI chip market. Cambricon's success comes as Chinese chipmakers, including MetaX Integrated Circuits, are gaining market share from Nvidia in China. Despite facing challenges, such as losing Huawei as a major customer, Cambricon has shown substantial growth and profitability. The company aims to increase its AI accelerator shipments in 2026 and is positioned as a key player in China's AI hardware supply chain.

Tom's Hardware

We use cookies

We use cookies to ensure you get the best experience on our website. For more information on how we use cookies, please see our cookie policy.