Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech

Apple and Broadcom job listings suggest potential collaboration with Intel for packaging future processor designs using Intel's EMIB and 2.5D memory packaging tech. While not confirmed, the listings require expertise in advanced packaging technologies, hinting at a possible partnership with Intel for chip packaging services. This move could benefit Intel's struggling foundry business, which has excelled in chip packaging but faced challenges in chip fabrication. If successful, this collaboration could reignite the partnership between Intel and Apple, potentially leading to future Apple chips incorporating Intel's silicon and packaging technologies.