Amkor breaks ground on Arizona advanced packaging campus, plugging critical gap in US semiconductor supply chain — production expected in 2028, investment could extend to $7 billion with 3,000 jobs in tow

Amkor has initiated the construction of a semiconductor packaging and test campus in Arizona, aiming to address critical gaps in the U.S. semiconductor supply chain. The facility is set to commence production in 2028, with potential investments reaching $7 billion and the creation of 3,000 jobs. The campus has already secured Apple and Nvidia as key customers and will focus on chip packaging for Apple silicon. This move aligns with U.S. officials' recognition of the importance of advanced packaging in bolstering the domestic chip industry, particularly for AI accelerators and complex integration needs.