AMD hit with lawsuit over hybrid bonding tech behind potent 3D V-Cache — Adeia claims company's gaming chip infringes 10 of its patents

Adeia has filed patent infringement lawsuits against AMD, claiming that AMD's chips use patented innovations related to hybrid bonding technology. The lawsuits involve ten patents, seven covering hybrid bonding and three related to process nodes for advanced logic and memory manufacturing. Adeia asserts that its patented work has significantly contributed to AMD's success, particularly in the design of the 3D V-Cache feature in Ryzen X3D processors. The case could potentially impact the future of chip scaling and the ownership of 3D chip design elements. While near-term disruption to AMD's products is unlikely, the outcome of the case may influence future licensing deals for hybrid-bonded processors.