AMD debuts Helios rack-scale AI hardware platform at OCP Global Summit 2025 — promises easier serviceability and 50% more memory than Nvidia's Vera Rubin

At the OCP Global Summit, AMD unveiled its Helios AI hardware platform designed for Meta OpenRack Wide, offering easier serviceability and 50% more memory than Nvidia's Vera Rubin. The platform features AMD Epyc server CPUs, Instinct 400 GPUs, Pensando networking interfaces, and ROCm software for enhanced performance and efficiency in AI infrastructure. Compliant with the Open Rack Wide specification, Helios aims to improve power, cooling, and serviceability for AI systems, enabling faster scaling for AMD partners. Oracle is set to deploy 50,000 MI450 GPUs in Q3 2026 as part of a collaboration with AMD, showcasing strong customer confidence in the platform's capabilities.