AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)

Researchers from the National Institute of Standards and Technology, Intel, and Colorado School of Mines have published a technical paper on a new AFM-based protocol for studying the incipient stages of plasticity in electroplated copper for hybrid bonding structures. This protocol aims to address the need for robust metrology in the semiconductor industry to understand mechanical behavior at the nanoscale. The paper highlights the importance of this research in the context of evolving packaging approaches in response to the slowdown of Moore's law. The study focuses on characterizing the mechanical properties of copper pads before bonding, crucial for advanced packaging techniques.