Advanced Part Average Testing For Chips

Part average testing for semiconductor chips is becoming more complex at advanced nodes and in multi-die assemblies. Previously, this testing method generated a Gaussian distribution that made identifying outliers easier, but this is no longer the case due to advanced packaging and designs. Aftkhar Aslam, CEO of yieldWerx, discusses the challenges of low yield in these chips, the necessity of multi-modal approaches for good yield, and how neighboring dies can complicate the testing process. These advancements require a deeper understanding of unique attributes like wafer thickness and zonal issues to determine applicable rules.