3DKs: Making Headway On Chiplet Standards

The article discusses the progress being made on chiplet standards, particularly in the development of 3DKs (assembly, test, material, and package design kits). The Open Compute Project (OCP) and JEDEC are working on creating a free and open chiplet marketplace to enable companies of all sizes to benefit from multi-chiplet systems. These design kits aim to streamline the process of designing, assembling, testing, and validating systems-in-package (SiPs). The goal is to extend the success of process design kits (PDKs) from the semiconductor industry into the packaging world. The article highlights the importance of collaboration and standardization in advancing chiplet technology.