Tech News
Back to home
Technology

3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds project performance expectations by 50%

Source

Tom's Hardware

Published

TL;DR

AI Generated

A research team has developed a 3D-printed liquid cooler for data centers that can passively cool up to 600 watts without fans or pumps, exceeding performance expectations by 50%. The cooler uses a two-phase thermosiphon design to transfer heat efficiently, with the expelled liquid reaching temperatures of 60 to 80°C for potential reuse in heating networks. The design minimizes material wastage during production and is cost-effective, with a budget of $1.56 million. The cooler's ability to lower chip temperatures could benefit AI accelerators, improving their longevity.

Read Full Article

Similar Articles

Six AI data centers proposed for a small town of 7,000, equal to 51 Walmart Supercenters in 17 square mile area — four out of the seven town council members have resigned from their positions as town fights back

Six AI data centers proposed for a small town of 7,000, equal to 51 Walmart Supercenters in 17 square mile area — four out of the seven town council members have resigned from their positions as town fights back

Developers have proposed building six AI data centers in Archbald, Pennsylvania, a small town with a population of 7,000. These data centers would cover 14% of the town's 17-square-mile area and are equivalent in size to 51 Walmart Supercenters. The community is pushing back due to concerns about the impact on local utilities, noise, and light pollution. The fight has led to resignations from town council members and delays in the projects, with President Donald Trump getting involved in urging hyperscalers to address community concerns.

Tom's Hardware•
New Jersey datacenter expansion got $77m in tax breaks to create exactly one permanent job — JPMorgan's site already scored $35m and currently employs just 25 workers

New Jersey datacenter expansion got $77m in tax breaks to create exactly one permanent job — JPMorgan's site already scored $35m and currently employs just 25 workers

A JPMorgan datacenter expansion in New Jersey received $77 million in tax breaks to create just one permanent job, marking a high subsidy-to-jobs ratio. The expansion, which is part of a $1 billion investment, currently employs only 25 workers despite the substantial tax incentives. The Industrial Development Agency (IDA) believes the deal will benefit the local economy, projecting a $100 million infusion. While the IDA acknowledges the lack of permanent jobs, they argue that the overall economic impact justifies the subsidy. The situation highlights the need for closer scrutiny of datacenter subsidies and their true economic impact.

Tom's Hardware•
Sudokoo SK620V and SK700V Review: Silent, Stylish AM5 cooling, with a built-in display

Sudokoo SK620V and SK700V Review: Silent, Stylish AM5 cooling, with a built-in display

Sudokoo introduces the SK620V and SK700V air coolers, featuring a sleek design with a built-in digital display showing CPU performance metrics. These coolers are specifically designed for AMD AM5 systems and incorporate a solid metal anti-bending frame for added durability. The SK620V and SK700V come with checkerboard matrix fins, copper heatpipes, and rail-based fan installation. While installation may be a bit challenging due to the custom metal frame, the coolers offer impressive noise levels and cooling performance. The article includes detailed specifications, pricing, and real-world testing results for these innovative CPU coolers.

Tom's Hardware•
SemiEngineering

Silicon Photonics Lights The Way To More Efficient Data Centers

Silicon photonics is paving the way for more efficient data centers by potentially increasing bandwidth density and reducing power consumption, particularly driven by AI workloads. However, challenges such as process compatibility, thermal issues, and mechanical stress arise due to the use of various materials in photonic interconnects. Integrated electro-optical I/O modules are the desired outcome, but design and process complexities need to be addressed. The article delves into the technical aspects of silicon photonics, including the components involved, such as light sources, modulators, waveguides, and photodetectors, as well as the challenges of integrating optical and electronic components for efficient data transmission.

SemiEngineering•

We use cookies

We use cookies to ensure you get the best experience on our website. For more information on how we use cookies, please see our cookie policy.