3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds project performance expectations by 50%

A research team has developed a 3D-printed liquid cooler for data centers that can passively cool up to 600 watts without fans or pumps, exceeding performance expectations by 50%. The cooler uses a two-phase thermosiphon design to transfer heat efficiently, with the expelled liquid reaching temperatures of 60 to 80°C for potential reuse in heating networks. The design minimizes material wastage during production and is cost-effective, with a budget of $1.56 million. The cooler's ability to lower chip temperatures could benefit AI accelerators, improving their longevity.