3D ESD verification: Tackling new challenges in advanced IC design

ESD verification for 3D IC designs presents new challenges due to the complexity of stacked-die architectures. Differentiating between external and internal IOs is crucial for efficient ESD protection, leading to optimized schemes and cost savings. Automation tools like Calibre 3DPERC are essential for meeting evolving ESD verification needs in heterogeneous 3D designs. ESD protection in 3D ICs requires evaluating protection at the system level, considering different technology nodes, and handling interfaces from multiple vendors. Adopting automated ESD verification methodologies is crucial for ensuring accurate and consistent protection in 3D designs, ultimately enhancing product reliability and longevity.