Back to home
Technology

‘200,000 living human neurons’ on a microchip demonstrated playing Doom — Cortical Labs CL1 video shows the gameplay and explains how the neurons learn the game

Source

Tom's Hardware

Published

TL;DR

AI Generated

Cortical Labs showcased its CL1 biological computer, powered by around 200,000 living human neurons on a microchip, playing Doom in a video demonstration. The company's research team explained the process behind this achievement, highlighting the complexity of training neurons to learn and play the game. While the neurons have previously played Pong, tackling Doom's 3D environment and gameplay required a more advanced approach. The video emphasized the adaptive real-time learning capabilities of the neurons and the potential for training them to handle increasingly complex tasks beyond gaming. Cortical Labs invited developers and researchers to explore the open CL1 API for further innovation.

Read Full Article

Similar Articles

Human brain cells set to power two new data centers, thanks to 'body-in-the-box' CL1 — Cortical Labs targets the AI energy crisis with biological computer that reportedly uses less energy than a calculator

Human brain cells set to power two new data centers, thanks to 'body-in-the-box' CL1 — Cortical Labs targets the AI energy crisis with biological computer that reportedly uses less energy than a calculator

Cortical Labs, an Australian tech startup, has partnered with DayOne to establish two data centers in Australia and Singapore powered by their CL1 biological computer. These data centers will utilize CL1 units, which contain a silicon chip with 200,000 lab-grown human neurons that respond to electrical stimuli, mimicking neural networks in the human brain. The CL1 is designed to consume significantly less energy than traditional computers, with each unit priced at around $35,000. This innovative approach to computing aims to address the energy consumption challenges associated with AI data centers, offering a more efficient and sustainable alternative.

Tom's Hardware
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu on TSMC Advanced Technology Design Solutions

Dr. L.C. Lu, a key figure at TSMC, focuses on design-technology co-optimization, packaging innovations, and AI-driven methodologies for next-gen semiconductor systems. TSMC emphasizes DTCO and DDCL innovations for scaling from N5 to A14 nodes, with NanoFlex and NanoFlex Pro architectures offering efficiency gains. N2P and N2U nodes incorporate advanced DTCO and power delivery optimizations, with hybrid dual-rail architectures achieving significant energy savings. TSMC collaborates with EDA partners for AI integration, enhancing productivity and design quality. Advanced packaging technologies like CoWoS and SoIC play a crucial role in enabling AI scaling, with memory bandwidth and interconnect performance scaling aggressively. TSMC addresses power delivery and thermal management challenges in AI systems through advanced solutions. TSMC's advancements in design methodologies and AI-driven automation promise improved productivity and scalability in chip-package co-design.

SemiWiki
MindsEye's sabotage mission is being slammed as dull and pointless

MindsEye's sabotage mission is being slammed as dull and pointless

Build A Rocket Boy accuses individuals of sabotaging MindsEye's launch, spending over €1 million on damaging efforts. The studio integrates the controversy into a new in-game mission, Blacklist, to showcase evidence of sabotage to players. However, reports describe the mission as lackluster and failing to deliver a compelling narrative. Critics attribute the launch issues to internal problems, such as management and design decisions, casting doubt on the sabotage claims. The saga continues as MindsEye's post-launch turmoil unfolds.

TweakTown
3DPrint.com

The Additive Chicken Coop, Part II: Rescoping

The article discusses the second part of the Additive Chicken Coop project, focusing on rescaling the project. It highlights the challenges faced in enabling JavaScript and cookies to continue reading the content. The article provides insights into the technical aspects of the project and the strategies employed to address the issues encountered during the rescaling process.

3DPrint.com

We use cookies

We use cookies to ensure you get the best experience on our website. For more information on how we use cookies, please see our cookie policy.